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| 90% Tin - 10% Lead alloy specified for special electrical applications to eliminate the risk of growing "tin whiskers." It has the same characteristics as tin with the reduction of the
tendency for the surface to grow thin metal filaments, called whiskers, from its surface. Whiskers can cause electrical malfunctions by bridging circuit elements. 90/10 alloy provides greater wear resistance than 60/40 solder plate and a
higher softening temperature to prevent unwanted deposit reflow. Tin Lead Plating excels in solderability. It melts at the lowest temperature (358 deg.F - 181 deg.C). |
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